Sick of working on the same technology and same chip over and over again? Ready to start working on the next-generation of ultra- high speed IC products - we're talking 100, 200, 400 ghz coherent solutions!
We are a rapidly growing, Pre-IPO startup that has shipped millions of units, have solid revenue #'s and are about 1-2 years from going IPO! Because our technology for high-speed applications is best-in-class, industry leaders are partnering with us to utilize our technology to help make the internet & other technologies faster and more robust. We can offer huge career growth, pre-IPO stock, a ton of exposure to cutting-edge tech and the fast-paced environment that will help you take your career to the next level!
What You Will Be Doing
- Concept through design / release of ultra-high-speed, mixed-signal SOC's, specifically within Package Design
- MCM package design from concept through fab / product release, managing offsite layout, high-speed optimization
- Power Distribution including clean power to analog / digital / mixed signal
- Optimizing Ball Map / Bump Map, decoupling cap strategies, etc.
- Thermal Solution Management, integrating new packaging tech, etc.
- Managing multiple designs concurrently, working with multi-disciplinary teams
What You Need for this Position
- BSEE /MSEE / PhD & strong background in high-performance, mixed signal package design including: Power Distribution, Thermal Design, High-Speed analog design routing, high density digital signal routing, etc.
- Design / Simulation tool experience (i.e. Ansys, Cadence)
- Background working closely with multi-faceted teams, external vendors, etc.
- Must be able to handle multiple, concurrent complete chip designs
- High volume production & startup mentality is a must
What's In It for You
- Well-Funded, Exciting, and Growing Start-Up with a real pre-IPO equity play
- Tremendous opportunity for career growth
- Competitive compensation + Stocks
- Great benefits package
So, if you're an expert high-speed SOC package design engineer, please apply today!
Looking forward to receiving your resume through our website and going over the position with you. Clicking apply is the best way to apply, but you may also:
Email your resume in Word to:
Jason.Kuna@CyberCoders.com
**Please do NOT change the email subject line in any way. You must keep the JobID: linkedin : JK-1207999 -- in the email subject line for your application to be considered.***
Jason Kuna - Recruiting Manager - CyberCoders
CyberCoders, Inc is proud to be an Equal Opportunity Employer
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, protected veteran status, or any other characteristic protected by law.
Your Right to Work – In compliance with federal law, all persons hired will be required to verify identity and eligibility to work in the United States and to complete the required employment eligibility verification document form upon hire.
We are a rapidly growing, Pre-IPO startup that has shipped millions of units, have solid revenue #'s and are about 1-2 years from going IPO! Because our technology for high-speed applications is best-in-class, industry leaders are partnering with us to utilize our technology to help make the internet & other technologies faster and more robust. We can offer huge career growth, pre-IPO stock, a ton of exposure to cutting-edge tech and the fast-paced environment that will help you take your career to the next level!
What You Will Be Doing
- Concept through design / release of ultra-high-speed, mixed-signal SOC's, specifically within Package Design
- MCM package design from concept through fab / product release, managing offsite layout, high-speed optimization
- Power Distribution including clean power to analog / digital / mixed signal
- Optimizing Ball Map / Bump Map, decoupling cap strategies, etc.
- Thermal Solution Management, integrating new packaging tech, etc.
- Managing multiple designs concurrently, working with multi-disciplinary teams
What You Need for this Position
- BSEE /MSEE / PhD & strong background in high-performance, mixed signal package design including: Power Distribution, Thermal Design, High-Speed analog design routing, high density digital signal routing, etc.
- Design / Simulation tool experience (i.e. Ansys, Cadence)
- Background working closely with multi-faceted teams, external vendors, etc.
- Must be able to handle multiple, concurrent complete chip designs
- High volume production & startup mentality is a must
What's In It for You
- Well-Funded, Exciting, and Growing Start-Up with a real pre-IPO equity play
- Tremendous opportunity for career growth
- Competitive compensation + Stocks
- Great benefits package
So, if you're an expert high-speed SOC package design engineer, please apply today!
Looking forward to receiving your resume through our website and going over the position with you. Clicking apply is the best way to apply, but you may also:
Email your resume in Word to:
Jason.Kuna@CyberCoders.com
**Please do NOT change the email subject line in any way. You must keep the JobID: linkedin : JK-1207999 -- in the email subject line for your application to be considered.***
Jason Kuna - Recruiting Manager - CyberCoders
CyberCoders, Inc is proud to be an Equal Opportunity Employer
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, protected veteran status, or any other characteristic protected by law.
Your Right to Work – In compliance with federal law, all persons hired will be required to verify identity and eligibility to work in the United States and to complete the required employment eligibility verification document form upon hire.
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